Our chip implementation solution can resolve multiple challenges associated with multi-
hundred-million gates design, GHz operating frequency, noise coupling at deep sub-micron, IR
drop, ESD, design for manufacturing (DFM), and time-to-market requirements.
Our advanced design process — equipped with quick prototyping, automatic power design
solution, iterations-reduction timing-driven solution, data flow analyzer, and clock adjust cell —
has been instrumental in hundreds of our clients’ first silicon successes at deep sub-micron
technology.
In addition, we offer hierarchical physical synthesis, clock tree synthesis, static timing analysis
with on-chip variation (OCV), formal verification, multiple power domain/on-off domain
verification, cross-talk fixing and prevention, and LVS/DRC.
Furthermore, our comprehensive design-for-testability (DFT) services including scan insertion,
boundary scan, memory BIST with smart BIST grouping, memory repair, memory ECC solution,
scan re-ordering, low power test pattern generation and compression, and fault simulation.
We also provide IP hardening, IP test circuit/test pattern integration, SoC integration service
from spec to GDSII or RTL to GDSII. In particular, we have successfully integrated GUC with
SoC for high-volume production for hundreds of clients over the past 30 years.
SunMan is the leading foundry of high-value analog semiconductor solutions and manufacturer
of advanced analog integrated circuits. Our services provide our clients with strong competitive
advantages in current and emerging markets.
You can also take advantage of our professional quality manufacturing service, made possible
by our collaboration with world-class wafer fabrication partners, packaging and testing suppliers,
as well as other supporting providers. We help you minimize entry barriers and technical risks
while shortening time-to-market, lowering time-to-volume, and ensuring punctual delivery of
high-quality products — so you can focus your resources on your core competency.
Our SoC manufacturing services consist of packaging, testing and product engineering, quality
and reliability assurance, as well as supply chain management. Contact us to learn more about
our comprehensive semiconductor services.