mechegrSunMan Engineering has extensive expertise in the field of Mechanical Engineering and Thermal Management Solutions related to design of:

  • Telecommunication equipments (NEBS compliant Routers, switched, security devices)
  • Wireless indoor and outdoor products
  • Computer hardware and high-end servers
  • Data centers
  • Gaming and entertainment electronics
  • Biomedical electronics
  • Military and aerospace electronics

Mechanical and thermal design go hand in hand to develop a reliable product to withstand structural and thermal stresses, shock and vibration, and high temperature operations.
Structural analysis is conducted using Finite Element Analysis (FEA) computing stresses and deformations at regions of interest subject to specific static or dynamic loads.
Thermal management consists of forced convection (air or liquid cooling) cooling and natural convection/radiation/conduction cooling. Thermal design starts with specifying chassis level parameters such as inlet/exhaust vents location and percentage opening, fan sizing and finally ends up into detail level board and package cooling such as heat sink and thermal interface material specification for every component on the board. Computational Fluid Dynamics (CFD) Simulations are utilized to design and optimize cooling mechanism for each application. Upon completion of design via simulation, experimental measurements are conducted using velocity probes and thermocouples in order to record airspeeds and component temperatures. Upon request, heat sink samples with mounting mechanisms will be delivered.

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1879 Lundy Ave, Suite 236,
San Jose, CA 95131

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