4 Layer Stackup

Please modify the variables below and then click on the ‘Calculate’ button. The trace impedance’s will then be calculated.
Notes: All values need to be filled to get the desired result.
1. All dimensions are in MIL (thousands of an inch).

2. For microstrip traces (0.1< W/H < 4.0; 1 < Εr < 16 ) where W = width of the trace H = height of the dielectric ·r = Dielectric constant 3. The Dielectric Constant of FR4 material may vary by as much as 20% (4.2 to 5.2). 4. The overall Dielectric Thickness (Cu to Cu) should total 62 MIL nominally. 5. Variables unavailable for modification have no significant effect on the impedance of the traces.

4 Layer Stackup(mils)
Material Type
Dielectric Thickness
Trace Width
Cu Thickness
Dielectric Constant
1 Conductive . . Microstrip
  Dielectric . . . Core/Pre-preg
2 Conductive . . .   Plane
  Dielectric . . . Core/Pre-preg
3 Conductive . . .   Plane
  Dielectric . . . Core/Pre-preg
4 Conductive . . Microstrip
  Total Board Thickness        

Click here to calculate the characteristic impedance of the traces.

Note: All care has been taken to ensure that the results are correct but no responsibility is taken for any errors.

Warning: " The calculators have been designed to work the best to our knowledge, but we do not take the responsibility of the solutions as they are dependent on the user inputs."

Copyright SunMan Engineering Inc.


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